Job Description
JOB SUMMARY:
* Contribute to the development/transfer, optimization, and documentation of the overall process flow and macro modules required to fabricate reliable, manufacturable silicon bipolar, CMOS, and DMOS IC's which meet parametric and performance goals.
* Characterize, evaluate, and document integrated semiconductor devices and reliability of circuit and process elements to ensure performance to quality standards.
DUTIES AND RESPONSIBILITIES:
* Set up and perform process and device simulations to determine initial process parameters, capabilities, and direction for optimization of new process flows.
* Design and perform experiments and analyze the results to determine the process sequences and parameters which will yield the target device parameters, by using the results of the process simulations or initial test lots as a starting point.
* Analyze data (electrical, in-process measurement or visual inspection) from the fabrication of test lots to determine which parameters require additional optimization.
* Work with Process Engineering to develop, characterize, and optimize process modules.
* Support the processing of the initial test chip and transfer lots fabricated with the new process to identify and correct any problem areas and work to achieve first-pass success.
* Write the documentation required to permit the new process to be transferred to production.
* Provide inputs to and work with Device Engineers to develop layout rules for the process being developed, using equipment specifications and experimental data.
* Recommend test structures for and contribute to the layout of test chip mask sets to aid in developing the new process and evaluating specific process-dependencies of device parameters.
SKILLS AND KNOWLEDGE:
* Knowledge of several of the following:
* Strong knowledge of semiconductor device physics and process integration
* Semiconductor fabrication processes (0.16, 0.13, 0.09um IC technologies)
* Device characterization techniques
* Device layout
* Reliability testing
* ESD and latchup protection techniques
* IC packaging
* Skills in DOE design, statistical data analysis, problem solving, writing, and communication.
SUPERVISORY RESPONSIBILITY:
May be assigned the role of Project Technical Lead providing work direction to other engineers within Engineering as well as personnel in other departments.
PHYSICAL DEMANDS/WORKING CONDITIONS:
Exposure to hazardous chemicals, high voltages and high equipment temperatures.